High Density Interconnect (HDI) printed circuit boards with advanced microvia technology, enabling miniaturized designs with superior signal integrity and reliability.
HDI technology is the cornerstone of modern compact electronics. By utilizing laser-drilled microvias, fine-line traces, and sequential build-up (SBU) construction, HDI PCBs pack more functionality into smaller footprints while improving electrical performance through shorter signal paths.
At HXP Circuit, we offer a full spectrum of HDI capabilities from 1+N+1 basic HDI to any-layer interconnect, supporting the most demanding applications in consumer electronics, medical devices, and aerospace systems.
Ultra-compact HDI motherboards and camera modules for mobile devices requiring maximum density in minimal space.
Flex-rigid HDI combinations for smartwatches, fitness trackers, and medical wearables with space constraints.
High-reliability HDI for implantables, diagnostic equipment, and portable monitoring devices.
Military-grade HDI boards with extended temperature range and vibration resistance for mission-critical systems.
Compact HDI for IoT sensors, gateways, and 5G NR modules demanding high-frequency signal integrity.
HDI for ADAS camera modules, radar, LiDAR, and in-vehicle infotainment systems.